BEST provides sound solutions for BGA & other grid array tool rework. Our engineers have developed better processes to make BGA rework more repeatable, consistent & reliable. They have been reworking BGAs since their beginning, & continue to stay current with
the latest package styles & techniques to rework them.
They have every "high end" piece of rework equipment currently available & always have the right tool for the job. Every project is performed by IPC Certified Technicians who have been specifically trained for BGA rework & X-ray verification. Each job is returned to you with a disc of the appropriate x-ray images. BEST has experience in reworking PoPs & other stacked packages including the rework of daughter boards & stacked connectors.
See of our recent articles here.
Repair of damaged solder mask between BGA pads & connecting vias is a critical step to prevent solder from flowing down the vias in the work of BGA replacement.Damaged or missing BGA pads are replaced by following an IPC recommended procedure. This procedure makes use of specially fabricated adhesive backed BGA pads that are bonded to the board surface.
Lifted Solder station pad needs to be repaired prior to replacement. When your design requires a changes or modification at a BGA site, using a standard jumper wire is normally not an option. Jumper wires are basically massive to fit under a BGA part. This modification procedure makes use of flat copper ribbon narrow to fit safely under the BGA part. This will BGA repair will save you from doing another board build.
Customers are pleased with the work they do Here are some recent comments on a BGA rework job:
The updated (motor driver replacement) boards are working, & even the repaired (uC replacement) boards, which they were not optimistic about, are programmed & communicating! (Andy)
BEST provides services including BGA part removal, site prep, replacement, salvage, x-ray or optical verification, circuit design changes, as well as
pad repair, trace repair & mask repair.
Our IPC Master Certification Middle also offers certification classes in SMD rework & technical support.
the latest package styles & techniques to rework them.
They have every "high end" piece of rework equipment currently available & always have the right tool for the job. Every project is performed by IPC Certified Technicians who have been specifically trained for BGA rework & X-ray verification. Each job is returned to you with a disc of the appropriate x-ray images. BEST has experience in reworking PoPs & other stacked packages including the rework of daughter boards & stacked connectors.
See of our recent articles here.
Repair of damaged solder mask between BGA pads & connecting vias is a critical step to prevent solder from flowing down the vias in the work of BGA replacement.Damaged or missing BGA pads are replaced by following an IPC recommended procedure. This procedure makes use of specially fabricated adhesive backed BGA pads that are bonded to the board surface.
Lifted Solder station pad needs to be repaired prior to replacement. When your design requires a changes or modification at a BGA site, using a standard jumper wire is normally not an option. Jumper wires are basically massive to fit under a BGA part. This modification procedure makes use of flat copper ribbon narrow to fit safely under the BGA part. This will BGA repair will save you from doing another board build.
Customers are pleased with the work they do Here are some recent comments on a BGA rework job:
The updated (motor driver replacement) boards are working, & even the repaired (uC replacement) boards, which they were not optimistic about, are programmed & communicating! (Andy)
BEST provides services including BGA part removal, site prep, replacement, salvage, x-ray or optical verification, circuit design changes, as well as
pad repair, trace repair & mask repair.
Our IPC Master Certification Middle also offers certification classes in SMD rework & technical support.
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