BGA Rework Process RE-7500

BGA rework Process RE-7500 - Flexible makes use of for all different kinds of Parts like SMD rework, Reballing,
CBGA, CCGA, CSP, QFN, MLF, PGA & All Epoxy undefiled BGA .. etc .
- Recommended for reworking All Plastic parts, PTH, Sockets,
Connectors & Metal Shields .
- Complete reworking Processes (Pre-Heating, Soak, Re-Flow
& cooling) stages are achieved for an correct & standard reworking process .
- IR with no effect on adjoining Part .
- Sensitive Temperature measurement sensor to receive an correct
& instantaneous Temperature reading & monitoring.
- Internal Picking Process for Safe & Stable Removal of the ICs.
- Manual or automatic (profiled) cooling process to accomplish complete
& Standard & cooling stage process for PCBs .
- Guaranteed homogeneous & safe uniform heat distribution .
- Programmable, Automated & dynamic control for the ER-7500
heaters .
- Guaranteed delivery of the heat energy at the exact time &
location
- Freely programmable temperature profiles .
- Actual time process monitor on your PC or Laptop computer .
- Avoiding Hot & Chilled spots occurrence with no nozzles focus hoods
usage .
- Optimal Tool for re balling
- Positioning in the coursework of rework process is applicable by using laser
pointer on PCB
- Exact & smooth jogging X-Y table included with the package.
- Simple & Friendly operation By Automatic, Manual or PC Modes.
- Prepared for sophisticated future technologies.